11 April 2022

Laird Connectivity introduces the newest addition to its system-on-module (SOM) portfolio, the Summit SOM 8M Plus based on the NXP Semiconductors i.MX 8M Plus applications processor and 88W8997 wireless SoC.

The Summit SOM 8M Plus is a highly-integrated and comprehensive hardware and software solution that combines NXP’s multi-core applications processing with NXP dual-band 2x2 Wi-Fi 5 and Bluetooth 5.3 connectivity for a broad range of advanced IoT applications.

“When Laird Connectivity asked us to recommend an applications processor that could serve the next generation of industrial-grade connected systems, the i.MX 8M Plus applications processor was an easy choice,” said Alex Dopplinger, marketing director for the building and energy segment at NXP Semiconductors. “It is the fullest-featured member of our scalable i.MX 8M family, targeting applications that range from industrial HMI, machine vision, service robot and drone control, fleet analytics, building management systems, gateways, and audio/voice systems. Laird Connectivity’s Summit SOM 8M Plus combines it with NXP’s Wi-Fi technology in a compact solution that simplifies and speeds time to market for secure connected products.”

The Summit SOM 8M Plus is “ideal for a broad range of applications, including harsh, industrial IoT rugged handheld devices, industrial IoT gateways, IoT vision solutions, and healthcare devices,” Laird opines. It supports the latest WPA3-Personal, WPA3-Enterprise, and WPA3-Enterprise SuiteB 192-bit security standards and has an upcoming FIPS 140-3 certification. It will be globally certified to reduce customers’ barrier to entry. Regulatory certifications will include FCC, IC, CE, RCM, MIC, and Bluetooth SIG approvals. lairdtech.com